A PCB surface finish is a coating between coating and a bare PCB. There are two main reason for this coating:
To protect copper form exposed Circuitry.
To ensure proper solderability.
ECI technology offers different solder finishes such as HASL, OSP, Immersion and ENIG and selecting right kind is not an easy task. Especially when electronics industry is getting complex every day and regulations like RoHS and WEEE have changed industry standards.
There are number of criteria to consider before choosing right solder finish which will reflect in later sections.
Lead free vs Leaded Process
Component type
Predictability
Reworkability
Cost
HASL and Lead free HASL.
For quite a long time HASL was one of the most popular surface finish decisions. However, over the years, manufacturers have understood its limitations. While this surface finish is less costly and robust, it leaves the uneven surface and not suitable for fine pitch components. Even though it comes in lead-free, there are other options that are more likely for the high-reliable product.
Pros:
Low cost
Repairable
Cons:
Poor wetting
Less suitable for PTH (Plated Through Hole)
Uneven surface
Not suitable for fine pitch component.
Immersion Tin:
Immersion Tin (ISn) is a very good surface finish for fine pitch and planar components. Also, very popular with press fit and backplanes, ISn has more pros that cons. It is very good at protecting copper from oxidization. However, it’s intermetallic relationship with copper can be a problem.
Pros:
High reliability
Cost effective
Planar
Lead-free
Cons:
Tin wiskering
Limited rework
Handling concern
Not good for PTH
Immersion Silver:
For this surface finish, its benefits outweigh its cost. It started getting popular when RoHS and WEEE standards took effect. This is a very good alternative to ENIG with fine pitch component. Immersion silver contains OSP prevent tarnishing but can be sensitive to contaminants both on the board and in air.
Pros:
RoHS compliant
Planar
Good for fine pitch
High stability
Cons:
Silver wiskerings
Tarnishing
High friction
OSP (Organic Solderability Preservative)
OSP is organic and water-based surface finish. It bonds with copper and protect copper pads before soldering. OSP require low equipment maintenance, environment friendly and comes lead free. However, it can be very sensitive to handle and is not as robust as HASL.
Pros:
Simple process
Repairable
Even surface
Lead-free
Cons:
Not good for PTH
Short shelf life
Sensitive
Electroless Nickel Immersion (ENIG)
ENIG is quickly becoming the most popular surface finish in the industry. ENIG is well suitable with majority of industry requirements such as lead-free and components like BGA and SOIC which needs even surface.
Pros:
Even surface
Robust
Lead-free
Good for PTH
Cons:
Expensive
Not good for rework
Black pad syndrome
Need more help to choose right surface finish for your new product? Contact ECI technology for help!
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